Epoxy Adhesives Overview - High Temperature Products
3, epoxy - anhydride system (1) KH-509 adhesive. Formula (parts by mass):
Phenolic Epoxy F-44 647 Anhydride Titanium Dioxide (200 mesh) Glass Powder (200 mesh)
100 80 50 50
After the resin and anhydride were melted and mixed at 80°C, the filler was added and mixed thoroughly.
Curing conditions: 150°C/3h or 150°C/1h+200°C/2h.
Performance: long-term working temperature 200 ~ 250 °C, instant high temperature 1000 °C. Used for bonding high-temperature non-structural parts and ablative materials.
(2) R-122 adhesive. Formula (parts by mass):
Dicyclopentadiene Dioxide R-122 Maleic anhydride Glycerine Quartz White silica 100 51 7.5 30 5
Curing conditions: 120°C/1h+150°C/2h+200°C/3h.
Performance: Shear strength (A1-A1), MPa. Room temperature 12.8, 100 °C 11.6, 150 °C 14.0, 200 °C 15. 5.
(3) Bisphenol S epoxy adhesive. Formula (parts by mass):
Bisphenol S Epoxy (epoxy value 0.54) MNA Anhydride DMP-30 Bisphenol S
100 80 1 2
Gel time 135 °C, 7 min.
Curing conditions: 135°C/2h+165°C/4h+200°C/16h.
Performance: Heat distortion temperature 199 °C. The heat distortion temperature after aging at 200°C/500h was 249°C, and the heat aging loss weight was 0.1%.
4, epoxy - phenolic system (1) CG-I-1 adhesive. Formula (parts by mass):
Epoxy resin E-42 100, phenolic resin 60.
Curing conditions: 110°C/1h+180°C/10h. Pressure 0.49MPa.
Performance: Shear strength, MPa: room temperature 26.6, 150°C 17.2.
Operating temperature 150 °C.
(2) Chenggong-1 adhesive. Formula (parts by mass):
Epoxy resin E-42 100, ammonia phenolic resin 22.5-30, resorcinol 7.5-10.
Curing conditions: After preheating at 80° C./30 min, pressure was applied 0.49 MPa, 105° C./1 h+150° C./1 h.
Performance: Shear strength (Al-A1), MPa: 18.1 at room temperature, 190°C 17.6, 220°C 15.3, 200°C/200h after aging 13.8. Water resistance, oil resistance, and brittleness.
(3) FHJ-12 adhesive. Formula (parts by mass):
Epoxy resin E-51 Phenolic resin Hexamethylene tetraamine 8-hydroxyquinoline Alumina powder 10 100 4 1.1 50
Curing conditions: 160°C/12h.
Performance: Shear strength (steel-steel): room temperature> 17.6 MPa, 150°C> 15.7 MPa. Use temperature 150 °C.
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Following is some of picture for electronic packaging :
If you are interesting in make beautiful and safety box for your electronic packaging ,please email me freely
Electronic Packaging
Electronic Packaging,Electronic Blister Packaging,Plastic Electronic Packaging,Electronic Toy Packaging
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