To what stage has 3D printed electronic products developed in China?
To what stage has 3D printed electronic products developed in China?
The electrical interconnection technology in the manufacture of electronic products has been marked by the development period marked by surface assembly technology, micro-assembly technology, three-dimensional assembly technology, high-density assembly technology and other technologies, and has gradually entered the photoelectric interconnection, green assembly, structural and functional component interconnection , The development period of new technologies marked by technologies such as interconnection of multi-media complex components. In order to ensure the electrical interconnection quality and efficiency of various types of new circuit components / modules, the electronics industry has put forward demands for new processes and methods that meet these requirements. The rapid manufacturing process of 3D printing and the unlimited technical complexity of structural features are especially suitable for the development of single parts of electronic products, small batches of multiple varieties, and the development of structural electronic products that are difficult to achieve by traditional manufacturing methods.
In the field of structural electronic product manufacturing, Optomec has been used in the production of small batches of products through aerosol jet 3D printing technology. The curved conformal antenna 3D printed using this technology or AR electronic devices directly printed on glasses are among them. Quite representative applications. So, to what extent have domestic companies or scientific research institutions developed in the field of 3D printed structural electronic products?
Alternate printing of base structure and wires
Structured electronics refers to the three-dimensional electrical structure that circuits and electronic components are attached to or embedded in the base structure according to a certain three-dimensional layout. Since the electrical part has a three-dimensional spatial layout, the space utilization rate of electronic products is improved and the volume is reduced. Typical structural electronic products include: curved conformal antennas, super sensor structural electronic devices, pressure-resistant structural electronic devices, etc.
The circuit of the traditional manufacturing process of structured electronics is attached to the substrate. The substrate is a two-dimensional planar thin plate. The circuit can only be arranged in two dimensions, making it difficult to manufacture new-type structured electronic devices. One of the new methods for manufacturing structural electronic devices is to print the circuit on a flexible flat plate and obtain a certain degree of three-dimensional size by bending the flat plate, but this method is still essentially two-dimensional printing, and it cannot be perpendicular to the flat plate. Design and manufacture circuits freely, and produce essentially two-dimensional or 2.5-dimensional structures.
Another new method of manufacturing structural electronic devices is to use SLA technology to 3D print a three-dimensional base structure, and then use a direct writing process to manufacture conductive lines on the outer surface of the base structure. Although a three-dimensional matrix structure is used in this method, the circuit only exists on the outer surface of the matrix structure, and is still a combination of two-dimensional circuits, and does not realize arbitrary arrangement in three-dimensional space. So, can an innovative process be used to manufacture new three-dimensional electronic devices? Xi'an Jiaotong University has realized the arbitrary arrangement of the three-dimensional space of structured electronic products through a 3D printing technology of simultaneous printing of wires and substrates.
Similar to other 3D printing products, before 3D printing, the circuit spatial distribution in the electronic device and the geometric dimensions of the printing substrate need to be designed according to the performance requirements of the structural electronic product. After the product modeling is completed, the 3D model is layered , Get the material distribution of each layer cross section, and compile the relative motion program of the print head integrated device and working platform.
Next, wire printing materials and matrix structure printing materials that meet product performance requirements are used for 3D printing of structural electronics. Wire printing materials can have three different forms, including low-melting metal wires such as copper-tin alloy, silver-tin alloy, tin-lead alloy, nano silver ion gel solution, conductive ink of conductive polymer hydrogel, and aluminum powder, copper Metal powder such as powder. The substrate's 3D printing material is ABS, PLA, PEEK insulating polymer wire.
When printing, first complete the 3D printing of the base part through the base 3D printing material and the print head, and then switch to the print head of the wire material, thereby performing the 3D printing of the wire part. No matter which of the three wire materials mentioned above is used, the wire material will be deposited into the 3D printed matrix structure through the print head.
After the printing of a layer of base structure and wires is completed, the workbench will drop a layered thickness, and the printing process of printing substrates and printed wires is repeated until all the base structure and wires are printed to obtain structural electrons. 
Editor in charge: Liu Qingqing
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