Specification of Electroplating Process - Copper Plating Process (II)
2024-10-27 03:00:52
(VI) Process Conditions
Current density (DK)
The current density is 15 to 18 A/dm2 when the drum is fully immersed, and 20 to 30 A/m2 when the drum is half immersed. The current density can be increased depending on the composition of the bath and other conditions, such as: increase the temperature of the bath, strengthen the stirring, the bath concentration can increase the working current density.
2. Temperature
The bath temperature is 42±1°C at full dip and 38±1°C at half dip. If the bath temperature is too low, not only the allowable operating current density is low, but also the copper sulphate is easily crystallized; if the bath temperature is high, the conductivity of the bath can be enhanced, but the plating crystals will be rough; if the bath temperature exceeds 45°C, The copper layer will become soft and the layout will be white.
3. Copper plating time
Copper plating time should be based on the required hardness of the copper layer, generally 1 to 1.5 hours a tank.
4. The anode in the copper plating tank
The anode is an electrolytic copper ball with a diameter of 40mm. Electrolytic copper balls tend to produce copper powder in the sulphate copper plating bath, resulting in burrs and rough coatings. The lower the phosphorus content of copper balls, the better. This will reduce the copper powder and avoid the occurrence of trachoma. If the phosphorus content of the copper ball is too high, a thick film will be formed on the surface of the copper ball, so that the anode will not be easily dissolved and the content of copper ions in the plating solution will decrease. The content of phosphorus in the copper ball is 0.035%-0.05%. At present, the phosphorus content of domestic copper ball is more than 0.05%, while the imported phosphorus content is only 0.038%, but the price is too expensive.
5. Anode distance The anode distance is 50~80mm.
6. Plate Roller Rotation The platen roll speed changes depending on the platen roll diameter.
7. Selection and use of hardness agent According to the company's equipment conditions, choosing the hardness agent with the best plating performance is an important part, because the hardness of the control copper layer is mainly adjusted by the additive amount in the plating solution. At present, there are many kinds of hardness agents, which are introduced as follows.
(1) MDC hardness agent is solid, with a tank of 6mg/L. It should be done with a minimum amount of ground. It is very sensitive to chloride (Cl-) and the use temperature is 25～30°C. It is not very suitable for China's national conditions. At present, few companies are using it.
(2) American Mignon hardness additive, its performance is brittle, it is difficult to control, the amount of supplement is 10ml/100Ah (based on the company's copper plating hardness), the use temperature is 40 ~ 52 °C.
(3) Japan Yamato hardness additives, there are two commonly used: one is Hard, the best plating performance, hardness, finish is very good, its biggest drawback is that the hardness of the storage period is short, only 3 to 7 days, so use The company gradually decreased. The other is COMSG, although its plating performance is not as good as Hard, but its hardness and smoothness are also very good. Its performance is flexible. The biggest advantage is that the storage period is long, up to 3 to 6 months, and it is not polluted by the environment. It is suitable for the situation of the equipment in the domestic plate-making factory, so it is greatly favored by the plate-making company. Production practice shows that the actual amount is slightly less than its recommended ratio. Such as: copper sulfate 200 ~ 250g / L, hardness additives 80 ~ 100ml/Ah, the use of temperature 40 ~ 45 °C, can not exceed 45 °C.
(4) The amount of copper plating solution and hardness additives must be optimal. It is the key to ensure the balance between brittleness and flexibility of the copper plating layer, so that the copper layer can achieve the best hardness, which is conducive to prolong the storage time and reduce the dosage. If the amount is too much, the copper plating layer is too hard and brittle, and it is easy to wear and scratch the needle; the flexibility is strong, the burrs are easily engraved with 30° or 38°, and the squeegee is used for engraving. The method for judging the toughness is: once the copper skin folds, the fold is repeated one time, that is, it is better to break off after two folds.
(5) The problem often encountered in actual production is that the hardness of the copper layer is not too high or too soft and unstable. Such as: sulfate ion is low, the current is larger, resulting in high hardness, too brittle, poor toughness, resulting in a long version of the drum storage time will appear cracking phenomenon; copper layer is too soft, causing the dot deformation. Therefore, we must achieve the best match of various elements, so that the copper layer brittleness and flexibility to achieve a balance, and can remain stable, which will depend on strict and careful management.
(7) Process maintenance
1. Anode casing anode bags prevent trachoma. After the anode bag is dirty, it should be replaced in time.
2. Regularly change the filter element of the copper plating solution to ensure that the solution is clean.
3. Check the bath liquid level frequently. If it is not enough, you should add softened water to the specified liquid level. The copper plating fluid test specification is once every two days.
4. The copper plating solution must be stirred well.
5. Clean the bottom of the cylinder frequently, usually once every 3 months, and the upper tank impurities must be cleaned once a week.
6. Check the bath temperature every day. It is best to hang the thermometer in the tank and strictly control the temperature.
7. Strict control of Baume degrees.
8. Check the additives daily to keep the amount of additives stable.
9. The bath is preferably capped and sealed to reduce air pollution.
10. Add copper balls every day. Copper balls should be soaked in dilute sulfuric acid and rinsed daily. The black copper powder on the surface of the copper ball should be washed away or washed with 1:15 dilute oxidizing water.
(8) Transmission
1. Calculate current: Immersion area × 18A/dm2 = total current.
2. Copper plating time (Ah): Ah = area x thickness / K. Among them, K is a theoretical constant and must be tested. Some companies require K=0.8, area units are square decimeters, and thickness units are micrometers. Copper thickness ranges from 90 to 200 microns. If the thickness is small, adjust the K value because the ampere hour is constant.
3. Method of power transmission (1) Gradually send current from small to large, send 1/3 in one minute and send it to the specified value in 3 minutes.
(2) After electroplating for 50Ah with a current of 100-200A, slowly increase the current to the calculated value.
4. Precautions (1) Observe the stability of the current, temperature, and voltage during the copper plating process.
(2) The tank pressure should be less than 12V when the equipment is conducting well. Larger voltage indicates less sulfuric acid and poor electrical conductivity.
(to be continued)
Current density (DK)
The current density is 15 to 18 A/dm2 when the drum is fully immersed, and 20 to 30 A/m2 when the drum is half immersed. The current density can be increased depending on the composition of the bath and other conditions, such as: increase the temperature of the bath, strengthen the stirring, the bath concentration can increase the working current density.
2. Temperature
The bath temperature is 42±1°C at full dip and 38±1°C at half dip. If the bath temperature is too low, not only the allowable operating current density is low, but also the copper sulphate is easily crystallized; if the bath temperature is high, the conductivity of the bath can be enhanced, but the plating crystals will be rough; if the bath temperature exceeds 45°C, The copper layer will become soft and the layout will be white.
3. Copper plating time
Copper plating time should be based on the required hardness of the copper layer, generally 1 to 1.5 hours a tank.
4. The anode in the copper plating tank
The anode is an electrolytic copper ball with a diameter of 40mm. Electrolytic copper balls tend to produce copper powder in the sulphate copper plating bath, resulting in burrs and rough coatings. The lower the phosphorus content of copper balls, the better. This will reduce the copper powder and avoid the occurrence of trachoma. If the phosphorus content of the copper ball is too high, a thick film will be formed on the surface of the copper ball, so that the anode will not be easily dissolved and the content of copper ions in the plating solution will decrease. The content of phosphorus in the copper ball is 0.035%-0.05%. At present, the phosphorus content of domestic copper ball is more than 0.05%, while the imported phosphorus content is only 0.038%, but the price is too expensive.
5. Anode distance The anode distance is 50~80mm.
6. Plate Roller Rotation The platen roll speed changes depending on the platen roll diameter.
7. Selection and use of hardness agent According to the company's equipment conditions, choosing the hardness agent with the best plating performance is an important part, because the hardness of the control copper layer is mainly adjusted by the additive amount in the plating solution. At present, there are many kinds of hardness agents, which are introduced as follows.
(1) MDC hardness agent is solid, with a tank of 6mg/L. It should be done with a minimum amount of ground. It is very sensitive to chloride (Cl-) and the use temperature is 25～30°C. It is not very suitable for China's national conditions. At present, few companies are using it.
(2) American Mignon hardness additive, its performance is brittle, it is difficult to control, the amount of supplement is 10ml/100Ah (based on the company's copper plating hardness), the use temperature is 40 ~ 52 °C.
(3) Japan Yamato hardness additives, there are two commonly used: one is Hard, the best plating performance, hardness, finish is very good, its biggest drawback is that the hardness of the storage period is short, only 3 to 7 days, so use The company gradually decreased. The other is COMSG, although its plating performance is not as good as Hard, but its hardness and smoothness are also very good. Its performance is flexible. The biggest advantage is that the storage period is long, up to 3 to 6 months, and it is not polluted by the environment. It is suitable for the situation of the equipment in the domestic plate-making factory, so it is greatly favored by the plate-making company. Production practice shows that the actual amount is slightly less than its recommended ratio. Such as: copper sulfate 200 ~ 250g / L, hardness additives 80 ~ 100ml/Ah, the use of temperature 40 ~ 45 °C, can not exceed 45 °C.
(4) The amount of copper plating solution and hardness additives must be optimal. It is the key to ensure the balance between brittleness and flexibility of the copper plating layer, so that the copper layer can achieve the best hardness, which is conducive to prolong the storage time and reduce the dosage. If the amount is too much, the copper plating layer is too hard and brittle, and it is easy to wear and scratch the needle; the flexibility is strong, the burrs are easily engraved with 30° or 38°, and the squeegee is used for engraving. The method for judging the toughness is: once the copper skin folds, the fold is repeated one time, that is, it is better to break off after two folds.
(5) The problem often encountered in actual production is that the hardness of the copper layer is not too high or too soft and unstable. Such as: sulfate ion is low, the current is larger, resulting in high hardness, too brittle, poor toughness, resulting in a long version of the drum storage time will appear cracking phenomenon; copper layer is too soft, causing the dot deformation. Therefore, we must achieve the best match of various elements, so that the copper layer brittleness and flexibility to achieve a balance, and can remain stable, which will depend on strict and careful management.
(7) Process maintenance
1. Anode casing anode bags prevent trachoma. After the anode bag is dirty, it should be replaced in time.
2. Regularly change the filter element of the copper plating solution to ensure that the solution is clean.
3. Check the bath liquid level frequently. If it is not enough, you should add softened water to the specified liquid level. The copper plating fluid test specification is once every two days.
4. The copper plating solution must be stirred well.
5. Clean the bottom of the cylinder frequently, usually once every 3 months, and the upper tank impurities must be cleaned once a week.
6. Check the bath temperature every day. It is best to hang the thermometer in the tank and strictly control the temperature.
7. Strict control of Baume degrees.
8. Check the additives daily to keep the amount of additives stable.
9. The bath is preferably capped and sealed to reduce air pollution.
10. Add copper balls every day. Copper balls should be soaked in dilute sulfuric acid and rinsed daily. The black copper powder on the surface of the copper ball should be washed away or washed with 1:15 dilute oxidizing water.
(8) Transmission
1. Calculate current: Immersion area × 18A/dm2 = total current.
2. Copper plating time (Ah): Ah = area x thickness / K. Among them, K is a theoretical constant and must be tested. Some companies require K=0.8, area units are square decimeters, and thickness units are micrometers. Copper thickness ranges from 90 to 200 microns. If the thickness is small, adjust the K value because the ampere hour is constant.
3. Method of power transmission (1) Gradually send current from small to large, send 1/3 in one minute and send it to the specified value in 3 minutes.
(2) After electroplating for 50Ah with a current of 100-200A, slowly increase the current to the calculated value.
4. Precautions (1) Observe the stability of the current, temperature, and voltage during the copper plating process.
(2) The tank pressure should be less than 12V when the equipment is conducting well. Larger voltage indicates less sulfuric acid and poor electrical conductivity.
(to be continued)
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