Electronic components shell packaging materials

【Patent Type】 Invention Patent 【Patent Name】 Packaging Materials for Electronic Components, etc. 【Applicant】 Showa Denko Packaging Co., Ltd.; Japan Catalysts [Inventor] Kawai Hideki; Tanaka Kami; Qingshan Takahiro; Nakazaki Mitsu [Master Applicant] Address] Kanagawa Prefecture, Japan [application number] 01818717.X
【 Application Date 】 2001.10.12
[Examination and announcement number] 1475037
【 Validation announcement date 】 2004.02.11
【 Main classification number 】 H01M2/02
[Category] H01M2/02 H01G9/08 B65G65/40
[Summary Item] 1. An electronic component case comprising a stretched film layer of a heat-resistant resin as an outer layer, a non-stretched film layer of a thermoplastic resin as an inner layer, and an aluminum foil layer disposed between the film layers. A packaging material is used in which an acrylic polymer layer is provided between the aluminum foil layer and the unstretched film layer.
[Instructions CD-ROM] D0406
[Abstract] An object of the present invention is to provide a packaging material for an electronic component case, an electronic component case using the packaging material, an electronic component having the case, and the like. The electronic component case packaging material has excellent processability and strength. The aluminum foil and the resin layer have high adhesiveness, water vapor permeability resistance, and heat sealing property, and are not invaded by an electrolyte or the like. The packaging material is a material having a heat-resistant resin stretched film layer as an outer layer, a thermoplastic resin unstretched film layer as an inner layer, and an aluminum foil layer disposed between the two film layers, characterized in that the above An acrylic polymer layer is disposed between the aluminum foil layer and the unstretched film layer.
【 Agency 】 Beijing Zhongxue Law Firm 【 Agent 】 Duan Chengen ; Chen Haihong