Improved surface mount packaging

Patent Name Improved Surface Mounted Package Patent Applicant GEM Service Co., Ltd. Principal Applicant Address California inventor J Harden; R.K. Williams; A. Chel; Guards. Application (Patent) No. 02813799.X Application date 2002.05.09 Certification date Approval announcement number 1526165 Approval announcement date 2004.09.01 Manual CD-ROM number D0435 Main classification number H01L23/48 Classification number H01L23/48 Division Original application No. Priority item Abstraction Space-efficient micro Electronic device packaging allows for greater functionality of each unit surface area of ​​the personal computer's motherboard. In a particular embodiment (630), a package with an anti-gull-winged wire (632) can reduce the area of ​​the peripheral trajectory occupied by the wire, thus allowing the maximum space in the package trajectory to be assigned to the package (634) and the packaged chip. Package embodiments consistent with the present invention can also reduce the vertical profile (Zprofile) of the package by providing a special notch (636) for receiving the wire foot end (632a), thereby reducing the gap between the package bottom and the PC motherboard. Clearance. Providing a linear leg that is located under the package and slightly curved relative to the main board of the personal computer can further reduce the vertical package side by eliminating the extra gap associated with the bend radius of the J-shaped wire. SATUM 1. A small-track semiconductor device package comprising: a plastic package for packaging a chip, the plastic package including a top end coupled to a bottom end through a plurality of sides; and a package including the package body a portion of the package wire, which is electrically connected to the chip, and an exposed portion of the wire extending from the side of the package, folded back along the side of the package, forming a first corner pointing toward the bottom of the package, and toward the package The bottom center is folded to form a wire leg on which a portion of the wire along the side of the package and the portion of the wire along the bottom of the package form an angle of less than 90[deg.] with respect to the underlying planar personal computer. The main board is slanted to a second angle to facilitate solder wetting.